BGA is even nastier than suface mount. The chip is delivered with pre-leaded "balls" underneath the chip, which melts and make the connection to the board when "baked off" in an owen...
So, it's kinda of a PGA variant of surface mount. In any case, it is more or less impossible to solder for a human beeing.
If it was a standard regular FPGA mount, it would be easy with a socket, but BGA is nasty...